The phase change material on which the PhaseSheet PTM is based is solid at room temperature. The material only begins to liquefy at temperatures above 45 degrees Celsius. For optimal distribution of the liquid PhaseSheet PTM and thus the lowest possible layer thickness, a high contact force of around 300-400N is required. PhaseSheet PTM has a very low viscosity in its liquid state and contracts again when it changes to a solid material. This mitigates the pump-out effect.

The pump-out effect is particularly pronounced when a copper cooler is combined with a graphics chip, because silicon and copper expand at different lengths when heated. The temperatures under load cause the heat spreader and the base plate to deform (concave or convex) and return to their original shape (straight) when cooled. This causes the thermal paste to slowly be squeezed out, for example between the heat spreader and the base plate of the CPU cooler.

PhaseSheet PTM is more durable than traditional thermal pastes, but not as durable as KryoSheet, for example, which is virtually maintenance-free. The maximum thermal conductivity of PhaseSheet PTM develops and stabilizes after about ten heat cycles at 60 degrees Celsius each.

Features:
Outstanding thermal conductivity
Consistently high performance
Very high durability
Versatile in application
Not electrically conductive
Easy to use

Scope of delivery
1x PhaseSheet PTM